Welcome to DSDE 2022
We would like to invite you to contribute to and participate in 2022 5th International Conference on Data Storage and Data Engineering (DSDE 2022), which will be held in Sanya, China during February 25-27, 2022.
DSDE is a forum for presenting excellent results and new challenges facing the field of Data Storage and Data Engineering. This conference offers good opportunities for the delegates to exchange new ideas, and to establish research and/or business links, as well as to build global partnership for potential collaboration.
Featured with keynote speeches, oral presentations, poster presentations and social event, DSDE 2022 welcomes submission of researches concerning any branch of Data Storage and Data Engineering and the participation of anyone who is interested in these fields.
As your safety is our top priority and concern, the conference has added online attendance / presentation for participants in case of you cannot attend the conference because of the COVID-19. Participants will benefit of registration fee reduction after choosing online attendance / presentation. Accepted papers after registration and online presentation will still be published normally.
We would like to thank for your support to the conference despite the current crisis situation. Please contact email@example.com for more information about online presentation.
All papers will be strictly double blind reviewed by the program committee, and accepted papers after proper registration and presentation will be published in the International Conference Proceedings Series by ACM (ISBN: 978-1-4503-9572-4), which will be archived in the ACM Digital Library, and indexed by Ei Compendex, Scopus, etc.
投稿文章将经过严格的审稿过程，最终录用并完成注册和报告的文章将由ACM出版到DSDE 2022会议论文集（ISBN号：978-1-4503-9572-4），收录在ACM数据库中，并被Ei Compendex和Scopus检索。
▶ DSDE 2021 conference proceedings (ACM-ISBN: 978-1-4503-8930-3) | ACM Digital Library | indexed by Ei Compendex and Scopus.
▶ DSDE 2019 conference proceedings (ACM-ISBN: 978-1-4503-7216-9) | ACM Digital Library | indexed by Ei Compendex and Scopus.